The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Oct. 16, 2018
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventor:

Myung Cheol Yoo, Pleasanton, CA (US);

Assignee:

LG INNOTEK CO. LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/04 (2010.01); H01L 33/32 (2010.01); H01L 33/00 (2010.01); H01L 33/40 (2010.01); H01L 33/46 (2010.01); H01L 33/60 (2010.01); H01L 33/14 (2010.01); H01L 33/38 (2010.01); H01L 33/42 (2010.01); H01L 33/62 (2010.01); H01L 33/54 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/32 (2013.01); H01L 33/0079 (2013.01); H01L 33/04 (2013.01); H01L 33/14 (2013.01); H01L 33/38 (2013.01); H01L 33/405 (2013.01); H01L 33/42 (2013.01); H01L 33/46 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01);
Abstract

A light emitting device can include a metal support structure comprising Cu; an adhesion structure on the metal support structure; a reflective conductive contact on the adhesion structure; a GaN-based semiconductor structure on the reflective conductive contact, in which the GaN-based semiconductor structure includes a first-type semiconductor layer on the metal support structure, an active layer on the first-type semiconductor layer, and a second-type semiconductor layer on the active layer, the GaN-based semiconductor structure includes a bottom surface proximate to the metal support structure, a top surface opposite to the bottom surface, and a side surface between the top surface and the bottom surface, and a first thickness of the GaN-based semiconductor structure from the bottom surface to the top surface is less than 5 micrometers; an interface layer on the GaN-based semiconductor structure; and a contact pad on the interface layer, in which a second thickness of the metal support structure is 0.5 times less than a width of the top surface of the GaN-based semiconductor structure.


Find Patent Forward Citations

Loading…