The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
May. 25, 2018
Samsung Electronics Co., Ltd., Suwon-si, KR;
Chang Hwa Park, Suwon-Si, KR;
Ichiro Ogura, Suwon-Si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes: a semiconductor chip having connection pads; a connection member having a first surface on which the semiconductor chip is disposed and a second surface opposing the first surface and including an insulating member and a redistribution layer formed on the insulating member and electrically connected to the connection pads; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; and a barrier layer disposed on the second surface of the connection member and including an organic layer containing fluorine.