The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Jun. 29, 2016
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Ryosuke Usui, Osaka, JP;
Tetsuzo Ueda, Osaka, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/34 (2006.01); H01L 23/473 (2006.01); H01L 23/495 (2006.01); H02M 7/48 (2007.01); H01L 23/053 (2006.01); H01L 23/528 (2006.01); H01L 49/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 23/053 (2013.01); H01L 23/49562 (2013.01); H01L 23/528 (2013.01); H01L 28/40 (2013.01); H02M 7/48 (2013.01); H05K 7/20927 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device includes a semiconductor module including a semiconductor element, a passive element, a cooling member, a first conductive member and a second conductive member. The cooling member is disposed between the semiconductor module and the passive element. And a first conductive member and a second conductive member electrically connect the semiconductor module and the passive element. Furthermore, two or more aspects of at least one of the first conductive member and the second conductive member face the cooling member.