The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Jun. 22, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Bartlomiej J. Pawlak, Leuven, BE;

Guillaume Bouche, Albany, NY (US);

Ajey P. Jacob, Watervliet, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/07 (2006.01); H01L 21/324 (2006.01); H01L 21/8234 (2006.01); H01L 21/02 (2006.01); H01L 27/088 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); H01L 21/822 (2006.01); H01L 21/8238 (2006.01); H01L 27/06 (2006.01); H01L 27/092 (2006.01); B82Y 10/00 (2011.01); H01L 29/423 (2006.01); H01L 29/775 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823431 (2013.01); B82Y 10/00 (2013.01); H01L 21/02488 (2013.01); H01L 21/02532 (2013.01); H01L 21/02664 (2013.01); H01L 21/8221 (2013.01); H01L 21/823437 (2013.01); H01L 21/823807 (2013.01); H01L 27/0688 (2013.01); H01L 27/0886 (2013.01); H01L 27/092 (2013.01); H01L 29/0673 (2013.01); H01L 29/42392 (2013.01); H01L 29/66227 (2013.01); H01L 29/66439 (2013.01); H01L 29/775 (2013.01); H01L 21/823814 (2013.01);
Abstract

Disclosed herein are a method of forming stacked elongated nanoshapes (NSs) (e.g., stacked nanowires (NWs)) of different semiconductor materials above a substrate, a method of forming different devices (e.g., stacked field effect transistors (FETs) having different type conductivities) using the stacked NSs and the resulting structures. In the methods, stacked elongated NSs made of the same first semiconductor material can be formed above a substrate. The stacked elongated NSs can include at least a first NS and a second NS above the first NS. The second NS can then be selectively processed in order to convert the second NS from the first semiconductor material to a second semiconductor material. The first and second NSs can subsequently be used to form first and second devices, respectively, wherein the second device is stacked above the first device. The first and second device can be, for example, first and second FETs, respectively.


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