The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Aug. 28, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Aditya Kumar, Saratoga Springs, NY (US);

Shiv Kumar Mishra, Mechanicville, NY (US);

Jean-Baptiste Jacques Laloë, Saratoga Springs, NY (US);

Wen Zhi Gao, Rexford, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 21/285 (2006.01); H01L 23/532 (2006.01); H01L 23/535 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76895 (2013.01); H01L 21/02063 (2013.01); H01L 21/02068 (2013.01); H01L 21/28556 (2013.01); H01L 21/28568 (2013.01); H01L 21/76805 (2013.01); H01L 21/76814 (2013.01); H01L 21/76846 (2013.01); H01L 21/76889 (2013.01); H01L 23/535 (2013.01); H01L 23/53266 (2013.01);
Abstract

Methods of forming a contact for a semiconductor device with double barrier layer sets, and a device so formed are disclosed. Methods may include: depositing a first metal layer contacting a semiconductor substrate in a contact opening; depositing a first nitride barrier layer on the first metal layer; and annealing after depositing the first nitride barrier layer to form silicide region in a junction area underlying the contact opening with the first metal layer and the semiconductor substrate. After the annealing, a second metal layer may be deposited, followed by a second nitride barrier layer. A conductor is formed in a remaining portion of the contact opening. The double barrier layer sets prevent the formation of volcano defects and also advantageously reduce contact resistance.


Find Patent Forward Citations

Loading…