The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Jun. 10, 2015
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventors:
Kota Zenzai, Nagaokakyo, JP;
Yosuke Terashita, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); C09D 5/24 (2006.01); H01G 4/232 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); C09D 5/24 (2013.01); H01G 4/2325 (2013.01); H01G 4/12 (2013.01);
Abstract
A conductive resin paste that includes a conductive component and a resin component, where the conductive component includes at least Ag and Cu, and the proportion of the Ag to the total amount of the Ag and Cu included in the conductive component falls within the range of 11.6 mass % to 28.8 mass %. As the conductive component, an Ag-coated Cu powder is used which has a Cu powder with a surface at least partially coated with Ag.