The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Sep. 30, 2015
Applicants:

Dowa Electronics Materials Co., Ltd., Tokyo, JP;

Dowa F-tec Co., Ltd., Kume-gun, Okayama, JP;

Inventors:

Satoru Tsuboi, Kume-gun, JP;

Yasunobu Mishima, Kume-gun, JP;

Keisuke Ayabe, Kume-gun, JP;

Masayasu Senda, Kume-gun, JP;

Assignees:

DOWA ELECTRONICS MATERIALS CO., LTD., Tokyo, JP;

DOWA F-TEC CO., LTD., Kume-gun, Okayama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 1/113 (2006.01); H01F 1/11 (2006.01); C04B 35/26 (2006.01); C04B 35/626 (2006.01); C04B 35/634 (2006.01); C01G 49/00 (2006.01); H01F 41/02 (2006.01);
U.S. Cl.
CPC ...
H01F 1/113 (2013.01); C01G 49/0036 (2013.01); C04B 35/2683 (2013.01); C04B 35/6261 (2013.01); C04B 35/62675 (2013.01); C04B 35/62695 (2013.01); C04B 35/63468 (2013.01); H01F 1/11 (2013.01); H01F 41/0266 (2013.01); C01P 2004/51 (2013.01); C01P 2004/61 (2013.01); C01P 2004/62 (2013.01); C01P 2006/11 (2013.01); C01P 2006/12 (2013.01); C01P 2006/42 (2013.01); C04B 2235/3201 (2013.01); C04B 2235/3213 (2013.01); C04B 2235/3274 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/96 (2013.01);
Abstract

There is provided a ferrite powder for bonded magnets capable of producing ferrite bonded magnets with high BH, excellent in MFR when converted to a compound, with high p-iHc, wherein an average particle size of particles obtained by a dry laser diffraction measurement is 5 μm or less, a specific surface area is 1.90 m/g or more and less than 3.00 m/g, a compression density is 3.40 g/cmor more and less than 3.73 g/cm, and a compressed molding has a coercive force of 2800 Oe or more and less than 3250 Oe.


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