The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Mar. 06, 2018
Applicant:

Futurewei Technologies, Inc., Plano, TX (US);

Inventors:

Xiaobing Lee, Santa Clara, CA (US);

Feng Yang, Portland, OR (US);

Yu Meng, Santa Clara, CA (US);

Yunxiang Wu, Cupertino, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/10 (2006.01); G06F 3/06 (2006.01); G06F 11/14 (2006.01); G11C 5/04 (2006.01); G06F 12/02 (2006.01); G11C 8/18 (2006.01); G06F 13/16 (2006.01); G11C 7/20 (2006.01); G11C 7/22 (2006.01); G11C 8/12 (2006.01); G11C 11/00 (2006.01); G11C 29/04 (2006.01);
U.S. Cl.
CPC ...
G11C 7/10 (2013.01); G06F 3/061 (2013.01); G06F 3/0644 (2013.01); G06F 3/0647 (2013.01); G06F 3/0655 (2013.01); G06F 3/0685 (2013.01); G06F 11/1469 (2013.01); G11C 5/04 (2013.01); G11C 7/1072 (2013.01); G06F 12/0246 (2013.01); G06F 13/1673 (2013.01); G11C 7/20 (2013.01); G11C 7/22 (2013.01); G11C 8/12 (2013.01); G11C 8/18 (2013.01); G11C 11/005 (2013.01); G11C 2029/0411 (2013.01); G11C 2207/2245 (2013.01);
Abstract

An apparatus comprises a hybrid-memory multi-chip package (MCP) including a non-volatile memory (NVM) in an NVM die; a dynamic random access memory (DRAM) in two or more DRAM die, wherein a portion of the DRAM is allocated as a cache memory for the NVM; and a hybrid controller for the NVM and DRAM. The hybrid controller includes an NVM interface to the NVM; a DRAM interface to the cache memory; a host interface to communicate data with a host processor, wherein the host interface includes a parallel data bus for reading and writing data directly with both of the DRAM and the NVM; and logic circuitry configured to interleave access by the host processor and hybrid controller to the DRAM and NVM.


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