The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Jun. 24, 2016
Applicant:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Inventors:

Abhinandan Majumdar, Ithaca, NY (US);

Brian J. Kocoloski, Pittsburgh, PA (US);

Leonardo Piga, Austin, TX (US);

Wei Huang, Frisco, TX (US);

Yasuko Eckert, Redmond, WA (US);

Assignee:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 9/48 (2006.01); G06F 9/50 (2006.01); G06F 1/20 (2006.01); G06F 1/329 (2019.01);
U.S. Cl.
CPC ...
G06F 9/4893 (2013.01); G06F 1/206 (2013.01); G06F 1/329 (2013.01); G06F 9/5094 (2013.01); Y02D 10/24 (2018.01);
Abstract

Systems, apparatuses, and methods for performing temperature-aware task scheduling and proactive power management. A SoC includes a plurality of processing units and a task queue storing pending tasks. The SoC calculates a thermal metric for each pending task to predict an amount of heat the pending task will generate. The SoC also determines a thermal gradient for each processing unit to predict a rate at which the processing unit's temperature will change when executing a task. The SoC also monitors a thermal margin of how far each processing unit is from reaching its thermal limit. The SoC minimizes non-uniform heat generation on the SoC by scheduling pending tasks from the task queue to the processing units based on the thermal metrics for the pending tasks, the thermal gradients of each processing unit, and the thermal margin available on each processing unit.


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