The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Oct. 30, 2017
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Kohei Higashi, Kanagawa, JP;

Naoki Tsukamoto, Kanagawa, JP;

Masataka Satou, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); B32B 15/08 (2006.01); C23C 18/30 (2006.01); C23C 18/31 (2006.01); B32B 5/02 (2006.01); B32B 15/04 (2006.01); H05K 1/02 (2006.01); H05K 3/18 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); C23C 18/38 (2006.01); C23C 18/54 (2006.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); B32B 5/028 (2013.01); B32B 15/04 (2013.01); B32B 15/08 (2013.01); C23C 18/1605 (2013.01); C23C 18/2086 (2013.01); C23C 18/30 (2013.01); C23C 18/31 (2013.01); C23C 18/38 (2013.01); H05K 1/0296 (2013.01); H05K 3/184 (2013.01); B32B 2307/202 (2013.01); B32B 2457/208 (2013.01); C23C 18/1653 (2013.01); C23C 18/54 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04111 (2013.01); G06F 2203/04112 (2013.01); H05K 2201/09245 (2013.01); H05K 2201/10128 (2013.01); H05K 2203/0557 (2013.01); H05K 2203/072 (2013.01);
Abstract

According to the invention, there are provided a conductive film which has a mesh-like metal layer composed of metal thin wires and in which visual recognition of the metal thin wires is suppressed and the metal layer has excellent conductive characteristics, a touch panel sensor, and a touch panel. A conductive film according to the invention includes a substrate; a patterned to-be-plated layer which is disposed on the substrate in a mesh pattern and has a functional group interacting with a plating catalyst or a precursor thereof; and a mesh-like metal layer which is disposed on the patterned to-be-plated layer and has a plurality of metal thin wires intersecting each other, an average thickness of the patterned to-be-plated layer is 0.05 to 100 μm, an average thickness of the metal layer is 0.05 to 0.5 μm, and an average intersection growing rate at an intersection of metal thin wires of the mesh of the metal layer is 1.6 or less.


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