The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Apr. 01, 2016
Applicant:

Csem Centre Suisse D'electronique ET DE Microtechnique Sa-recherche ET Développement, Neuchâtel, CH;

Inventors:

Serge Droz, Bôle, CH;

Grégory Musy, Cortaillod, CH;

Emmanuel Dominé, Peseux, CH;

François Barrot, Erlach, CH;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G04B 37/05 (2006.01); G04B 31/02 (2006.01); G04B 37/04 (2006.01); B29C 35/08 (2006.01); B29C 39/10 (2006.01); B29C 65/48 (2006.01); F16F 13/04 (2006.01); F16F 15/02 (2006.01); F16F 9/30 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
G04B 37/055 (2013.01); B29C 35/0805 (2013.01); B29C 39/10 (2013.01); B29C 65/48 (2013.01); F16F 9/306 (2013.01); F16F 13/04 (2013.01); F16F 15/022 (2013.01); G04B 31/02 (2013.01); G04B 37/0418 (2013.01); B29C 2035/0827 (2013.01); B29L 2031/721 (2013.01);
Abstract

A shock-absorber and/or vibration-absorber device is proposed, comprising at least one flexible element able to deform under the effect of a stress; said device being remarkable in that it includes at least one so-called dissipative layer made from a material having a shear modulus lower than the shear modulus of the flexible element, a shock-absorbing factor greater than the shock-absorbing factor of said flexible element, and at least partially secured to said flexible element such that a flexion of the flexible element, under the effect of a stress, provides shearing of the dissipative layer making it possible to dissipate at least part of the energy from said stress. A method for manufacturing said shock-absorber device is also disclosed.


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