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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10451969 B1

PDFFull Text
Date of Patent:
Oct. 22, 2019

Filed:

Apr. 20, 2016

Resin composition, method for manufacturing semiconductor element using the same, and semiconductor device

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Takenori Fujiwara, Otsu, JP;

Yugo Tanigaki, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

Ratnerprestia

Primary Examiner:

Cynthia Hamilton

Int. Cl.
CPC ...
G03F 7/038 (2006.01); C08L 79/04 (2006.01); C08L 79/08 (2006.01); G03F 7/40 (2006.01); C08F 212/14 (2006.01); C08G 73/10 (2006.01); G03F 7/039 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); H01L 21/22 (2006.01); H01L 21/308 (2006.01); H01L 21/3205 (2006.01); G03F 7/004 (2006.01); G03F 7/023 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0387 (2013.01); C08F 212/14 (2013.01); C08G 73/1071 (2013.01); C08L 79/04 (2013.01); C08L 79/08 (2013.01); G03F 7/0046 (2013.01); G03F 7/0233 (2013.01); G03F 7/039 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/20 (2013.01); G03F 7/322 (2013.01); G03F 7/40 (2013.01); H01L 21/22 (2013.01); H01L 21/3081 (2013.01); H01L 21/3086 (2013.01); H01L 21/32051 (2013.01);
Abstract

Provided is a resin composition including: (A1) an alkali-soluble resin having a specific structural unit; (A2) at least one resin selected from the group consisting of polyimides, polybenzoxazoles, polyamideimides, precursors thereof, and copolymers thereof, the resin having a substituent that reacts with a reactive group of the alkali-soluble resin; and (B) a photosensitizer, in which the amount of the resin (A2) is 310 to 2,000 parts by weight with respect to 100 parts by weight of the resin (A1).

Find Patent Forward Citations

Fujiwara, Takenori. (2019). Resin composition, method for manufacturing semiconductor element using the same, and semiconductor device (U.S. Patent No. 10451969). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10451969

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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