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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10451690 B1

PDFFull Text
Date of Patent:
Oct. 22, 2019

Filed:

Sep. 25, 2017

Customized magnetic susceptibility materials

Applicant:

Michael D. Bulatowicz, Canoga Park, CA (US);

Inventor:

Michael D. Bulatowicz, Canoga Park, CA (US);

Assignee:

NORTHROP GRUMMAN SYSTEMS CORPORATION, Falls Church, VA (US);

Attorney:

Tarolli, Sundheim, Covell & Tummino LLP

Primary Examiner:

David Sample

Assistant Examiner:

Donald M Flores, Jr

Int. Cl.
CPC ...
G01R 33/34 (2006.01); G01R 33/565 (2006.01); B05D 7/00 (2006.01); B32B 15/00 (2006.01); B32B 15/01 (2006.01); B32B 18/00 (2006.01); C04B 37/00 (2006.01); C04B 37/02 (2006.01); G01C 19/00 (2013.01); G01C 19/60 (2006.01); G01R 33/00 (2006.01); G01R 33/42 (2006.01);
U.S. Cl.
CPC ...
G01R 33/34 (2013.01); B05D 7/52 (2013.01); B32B 15/00 (2013.01); B32B 15/01 (2013.01); B32B 18/00 (2013.01); C04B 37/001 (2013.01); C04B 37/021 (2013.01); G01C 19/00 (2013.01); G01C 19/60 (2013.01); G01R 33/00 (2013.01); G01R 33/56536 (2013.01); C04B 2237/34 (2013.01); C04B 2237/348 (2013.01); C04B 2237/36 (2013.01); C04B 2237/408 (2013.01); G01R 33/42 (2013.01); Y10T 428/23 (2015.01); Y10T 428/239 (2015.01);
Abstract

One example includes a method for fabricating a compound material. The method includes providing a first discrete material layer having a first thickness dimension. The first discrete material layer includes a first material having a first magnetic susceptibility. The method also includes depositing a second discrete material layer having a second thickness dimension over the first discrete material layer. The second discrete material layer can include a second material having a second magnetic susceptibility. The relative first and second thickness dimensions can be selected to provide a desired magnetic susceptibility of the compound material.

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