The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Jan. 23, 2017
Applicant:

Omnivision Technologies, Inc., Santa Clara, CA (US);

Inventor:

Bowei Zhang, Fremont, CA (US);

Assignee:

OmniVision Technologies, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C12Q 1/6809 (2018.01); G01N 21/64 (2006.01); G01N 21/03 (2006.01); B01L 3/00 (2006.01); B01L 7/00 (2006.01); G01N 21/17 (2006.01); G01J 3/44 (2006.01);
U.S. Cl.
CPC ...
G01N 21/6428 (2013.01); B01L 3/502715 (2013.01); B01L 7/525 (2013.01); C12Q 1/6809 (2013.01); G01N 21/0332 (2013.01); G01N 21/1717 (2013.01); G01N 21/6454 (2013.01); G01N 21/6456 (2013.01); B01L 2300/044 (2013.01); B01L 2300/047 (2013.01); B01L 2300/0803 (2013.01); B01L 2300/0887 (2013.01); B01L 2300/1827 (2013.01); G01J 3/4406 (2013.01); G01N 2021/1731 (2013.01); G01N 2021/6419 (2013.01); G01N 2021/6421 (2013.01); G01N 2021/6471 (2013.01);
Abstract

A method for high-throughput assay processing includes (a) modulating temperature of a plurality of samples disposed in a respective plurality of fluidic channels on an image sensor wafer, including a plurality of image sensors, by heating the image sensor wafer using a heating module thermally coupled with the image sensor wafer, to control reaction dynamics in the samples, and (b) capturing a plurality of fluorescence images of the samples, using the plurality of image sensors, to detect one or more components of the plurality of samples. A method for manufacturing a high-throughput fluorescence imaging system with sample heating capability includes (a) bonding a fluidic wafer, including a plurality of recesses, to an image sensor wafer including a plurality of image sensors, and (b) bonding a heating module, including a heater for generating heat, to the image sensor wafer to thermally couple the heater and the image sensor wafer.


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