logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10450667 B1

PDFFull Text
Date of Patent:
Oct. 22, 2019

Filed:

Oct. 27, 2014

System for treating solution for use in electroplating application and method for treating solution for use in electroplating application

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Charles L. Arvin, Savannah, GA (US);

Glen N. Biggs, Wappingers Falls, NY (US);

Phillip W. Palmatier, Hopewell Junction, NY (US);

Joseph C. Sorbello, Wappingers Falls, NY (US);

Tracy A. Tong, Wallkill, NY (US);

Freddie Torres, Beacon, NY (US);

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);

Attorneys:

Scully, Scott, Murphy & Presser, P.C.

Alvin Borromeo, Esq.

Primary Examiner:

Bryan D Ripa

Assistant Examiner:

Ho-Sung Chung

Int. Cl.
CPC ...
C25D 21/18 (2006.01); C25D 21/06 (2006.01); C25D 21/14 (2006.01); C25D 3/30 (2006.01); C25D 3/38 (2006.01);
U.S. Cl.
CPC ...
C25D 21/18 (2013.01); C25D 21/06 (2013.01); C25D 21/14 (2013.01); C25D 3/30 (2013.01); C25D 3/38 (2013.01);
Abstract

Electroplating techniques including a system for treating a solution for use in an electroplating application and a method for using the system are provided. The system can have: a gas dispersing portion configured to treat the solution by dispersing a gas into the solution to control a concentration of a predetermined cation of a metal to be electroplated in the electroplating application; a filter portion configured to treat the solution by filtering the solution to remove a quantity of metal residue; and a circulation mechanism configured to divert the solution to one of a plating tool and a combination of the gas dispersing portion and the filter portion based on a result of an analysis of the solution.

Find Patent Forward Citations

Quick Actions:

Arvin, Charles. (2019). System for treating solution for use in electroplating application and method for treating solution for use in electroplating application (U.S. Patent No. 10450667). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10450667

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…