The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Jul. 13, 2016
Applicant:

Hamilton Sundstrand Corporation, Charlotte, NC (US);

Inventors:

Neal Magdefrau, Tolland, CT (US);

Paul Sheedy, Bolton, CT (US);

Sonia Tulyani, Glastonbury, CT (US);

Assignee:

Hamilton Sundstrand Corporation, Charlotte, NC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 4/06 (2016.01); C22C 45/00 (2006.01); C23C 4/12 (2016.01); B29C 65/02 (2006.01); B29C 65/70 (2006.01); C23C 24/04 (2006.01); B23K 20/16 (2006.01); B23K 35/00 (2006.01); F16B 11/00 (2006.01); C23C 4/02 (2006.01); C23C 4/18 (2006.01); C23C 24/08 (2006.01); C23C 14/56 (2006.01); F16B 5/07 (2006.01);
U.S. Cl.
CPC ...
C23C 4/12 (2013.01); B23K 20/16 (2013.01); B23K 35/00 (2013.01); B29C 65/02 (2013.01); B29C 65/70 (2013.01); C22C 45/00 (2013.01); C23C 4/02 (2013.01); C23C 4/06 (2013.01); C23C 4/18 (2013.01); C23C 14/568 (2013.01); C23C 24/04 (2013.01); C23C 24/08 (2013.01); F16B 11/00 (2013.01); F16B 5/07 (2013.01);
Abstract

A method of joining includes bringing a bulk metallic glass (BMG) material to a temperature lower than the crystallization temperature of the BMG material and depositing the BMG material onto a first substrate with interlock surface features such that the BMG material interlocks with the interlock surface features of the substrate. The method includes joining a second substrate to the BMG material, wherein the second substrate includes interlock surface features such that the BMG material interlocks with the interlock surface features of both the first and second substrates, joining the first and second substrates together to produce a fully amorphous joint between the first and second substrates.


Find Patent Forward Citations

Loading…