The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Oct. 14, 2016
Applicants:

General Cable Technologies Corporation, Highland Heights, KY (US);

Nanoal, Llc, Skokie, IL (US);

Inventors:

Srinivas Siripurapu, Carmel, IN (US);

Cornelius A. Muojekwu, Indianapolis, IN (US);

Janusz Stanislaw Sekunda, Williamsport, PA (US);

Richard Stephen Baker, Cumming, GA (US);

Nicholas John Duer, Highland Heights, KY (US);

Nhon Q. Vo, Skokie, IL (US);

Assignees:

General Cable Technologies Corporation, Highland Heights, KY (US);

NanoAl, LLC, Skokie, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/24 (2006.01); C22C 21/00 (2006.01); C22F 1/04 (2006.01); C21D 1/25 (2006.01); B23K 35/28 (2006.01); B23K 35/02 (2006.01); B23K 35/40 (2006.01); H01M 2/10 (2006.01); H01M 2/20 (2006.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
C22C 21/00 (2013.01); B23K 35/0227 (2013.01); B23K 35/288 (2013.01); B23K 35/40 (2013.01); C21D 1/25 (2013.01); C22F 1/04 (2013.01); H01B 1/023 (2013.01); H01M 2/1077 (2013.01); H01M 2/206 (2013.01); H01M 2220/20 (2013.01);
Abstract

A conductive element of a cable or a wire is formed of an improved aluminum-zirconium alloy. The aluminum-zirconium alloy further includes an inoculant. The aluminum-zirconium alloy exhibits excellent ultimate tensile strength values and resistance to heat. Bonding wires formed from an improved aluminum-zirconium alloy exhibiting certain ultimate tensile strength values, fatigue resistance and/or creep rates are also described. Methods of forming cables and wires are also further disclosed.


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