The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Sep. 13, 2012
Applicants:

Seigo Kodama, Ama-gun, JP;

Kenji Tsukada, Toyota, JP;

Masatoshi Fujita, Anjyo, JP;

Inventors:

Seigo Kodama, Ama-gun, JP;

Kenji Tsukada, Toyota, JP;

Masatoshi Fujita, Anjyo, JP;

Assignee:

FUJI CORPORATION, Chiryu-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 10/00 (2015.01); B29C 67/00 (2017.01); B33Y 80/00 (2015.01); B22F 3/105 (2006.01); B29C 64/00 (2017.01); B29C 64/153 (2017.01); B33Y 30/00 (2015.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 67/0077 (2013.01); B22F 3/1055 (2013.01); B29C 64/00 (2017.08); B29C 64/153 (2017.08); B33Y 80/00 (2014.12); B29L 2031/34 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12);
Abstract

When manufacturing three-dimensional electronic device by layering multiple layer cross sections sliced at a predetermined thickness of three-dimensional electronic device which is the target for forming, first, each layer cross section using multiple types of materials is formed by being layered on top of the layer cross section underneath, and each time a layer cross section is formed, the cross section is cured or sintered by being exposed to ultraviolet light, a laser beam, visible light, and so on. The forming method for each cross section may be forming cross section by discharging a binder via a droplet discharge method such as inkjet printing or dispensing, or by spreading a layer of powdered material and bonding the powdered material by discharging a binder or sintering it by exposing it to a laser beam.


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