The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Dec. 02, 2013
Applicant:

Jnc Corporation, Tokyo, JP;

Inventors:

Kenya Ito, Chiba, JP;

Koji Ohguma, Chiba, JP;

Assignee:

JNC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/16 (2006.01); B32B 7/02 (2019.01); B32B 15/08 (2006.01); B29C 45/14 (2006.01); B32B 27/38 (2006.01); B32B 27/40 (2006.01); B32B 27/42 (2006.01); C09D 1/00 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01); B32B 37/02 (2006.01); B29K 101/10 (2006.01); B32B 37/26 (2006.01);
U.S. Cl.
CPC ...
B29C 45/1679 (2013.01); B29C 45/14016 (2013.01); B29C 45/1418 (2013.01); B29C 45/14827 (2013.01); B32B 7/02 (2013.01); B32B 15/08 (2013.01); B32B 27/08 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); B32B 27/40 (2013.01); B32B 27/42 (2013.01); B32B 37/02 (2013.01); C09D 1/00 (2013.01); B29K 2101/10 (2013.01); B29K 2995/0005 (2013.01); B32B 2037/268 (2013.01); B32B 2255/10 (2013.01); B32B 2255/28 (2013.01); B32B 2262/103 (2013.01); B32B 2307/202 (2013.01); B32B 2307/306 (2013.01); B32B 2307/412 (2013.01); B32B 2307/558 (2013.01); B32B 2307/714 (2013.01); B32B 2307/734 (2013.01); B32B 2307/748 (2013.01); B32B 2310/0831 (2013.01); B32B 2398/10 (2013.01); B32B 2571/00 (2013.01);
Abstract

The transfer film for in-mold molding of the invention has transfer layerbeing a transfer layer to be transferred onto a transfer object in in-mold molding and cured by irradiation with an active energy ray after being transferred; and film-like base L. Transfer layerhas topcoat layer Llaminated on base Lto be arranged on a surface of a molded product after in-mold molding; and conductor layer Llaminated on a side opposite to a base Lside of topcoat layer L, and laminated on topcoat layer L. Topcoat layer Lis composed of a mixed composition containing an active energy ray-curable resin and a thermosetting resin, and conductor layer Lis formed of at least one kind selected from the group of a flexible metal, carbon and conductive polymer.


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