The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
May. 13, 2016
Nakanishi Metal Works Co., Ltd., Osaka-shi, JP;
NAKANISHI METAL WORKS CO., LTD., Osaka-shi, JP;
Abstract
The present invention is intended to provide an injection molding die that improves the strength of adhesion between an insert and a plastic in an insert molded article while suppressing fluctuations in the strength of adhesion. An injection molding die is used to manufacture an insert molded article by placing an insertwith a thermoset resin adhesive in the molding die and injecting a molten plastic material P from a gate G into a cavity C. The gate G is arranged at a position separated by 0.2 mm or more in an out-of-plane direction from a surface Aof the adhesive applied to the joining surface of the insert. During injection molding, the wall surface shear stress generated on the adhesive applied to the joining surface of the insertrelative to the plastic near the gate G becomes small. The adhesive is not swept away by the high-pressure molten plastic material P without having to bring the adhesive applied to the joining surface A of the insertinto the semi-cured state. Accordingly, it is possible to conduct injection molding without bringing the adhesive into the semi-cured state.