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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10449701 B1

PDFFull Text
Date of Patent:
Oct. 22, 2019

Filed:

Feb. 01, 2017

Molded product production system

Applicant:

Kikusui Seisakusho Ltd., Kyoto-shi, JP;

Inventors:

Naoshige Kitamura, Kyoto, JP;

Jun Oyama, Kyoto, JP;

Assignee:

KIKUSUI SEISAKUSHO LTD., Kyoto-Shi, Kyoto, JP;

Attorney:

McGinn I.P. Law Group, PLLC.

Primary Examiner:

Anthony Calandra

Assistant Examiner:

Jamel M Nelson

Int. Cl.
CPC ...
B29C 43/58 (2006.01); B01F 15/00 (2006.01); B01F 15/04 (2006.01); B01F 3/18 (2006.01); B30B 11/08 (2006.01); B30B 15/30 (2006.01); B01F 7/00 (2006.01); B01F 7/04 (2006.01); B01F 7/20 (2006.01); B01F 13/10 (2006.01); B29B 7/44 (2006.01); B29B 7/72 (2006.01); B29B 7/80 (2006.01); B29C 43/02 (2006.01); B29C 43/34 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 43/58 (2013.01); B01F 3/18 (2013.01); B01F 7/00133 (2013.01); B01F 7/00158 (2013.01); B01F 7/00275 (2013.01); B01F 7/00316 (2013.01); B01F 7/00633 (2013.01); B01F 7/04 (2013.01); B01F 7/20 (2013.01); B01F 13/1027 (2013.01); B01F 15/00207 (2013.01); B01F 15/00253 (2013.01); B01F 15/00272 (2013.01); B01F 15/00285 (2013.01); B01F 15/0408 (2013.01); B29B 7/44 (2013.01); B29B 7/726 (2013.01); B29B 7/80 (2013.01); B29C 43/02 (2013.01); B29C 43/34 (2013.01); B30B 11/08 (2013.01); B30B 15/302 (2013.01); B01F 2215/0032 (2013.01); B29C 2043/585 (2013.01); B29C 2043/5875 (2013.01); B29K 2105/251 (2013.01);
Abstract

A molded product production system includes at least two measuring feeders configured to simultaneously adjust an amount of a discharged powdery material to a target value and feed the powdery material, a mixer configured to mix at least two powdery materials fed from the measuring feeders to obtain mixed powdery materials, a filler configured to fill, with the mixed powdery materials obtained by the mixer, a die bore of a compression-molding machine configured to compress a powdery material to mold a molded product, a sensor configured to measure a mixing degree of the mixed powdery materials obtained by the mixer, and a controller configured to adjust an amount of at least one of the powdery materials fed by the measuring feeders, or motion speed of a mixing member configured to agitate powdery materials in the mixer in accordance with the mixing degree of the mixed powdery materials measured by the sensor.

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