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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10449698 B1

PDFFull Text
Date of Patent:
Oct. 22, 2019

Filed:

Aug. 17, 2015

Bonded structure and method for producing bonded structure

Applicant:

Omron Corporation, Kyoto, JP;

Inventors:

Kazuyoshi Nishikawa, Ritto, JP;

Akio Sumiya, Kusatsu, JP;

Satoshi Hirono, Kusatsu, JP;

Tomoyuki Hakata, Uji, JP;

Hiroshige Uematsu, Otsu, JP;

Assignee:

OMRON CORPORATION, Kyoto, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Catherine A Simone

Int. Cl.
CPC ...
B29C 37/00 (2006.01); B29C 45/14 (2006.01); B32B 3/30 (2006.01); B32B 7/04 (2019.01); B32B 15/08 (2006.01); B23K 26/352 (2014.01); B23K 26/00 (2014.01); B29C 65/06 (2006.01); B29C 65/08 (2006.01); B29C 65/16 (2006.01); B29C 65/18 (2006.01); B29C 65/00 (2006.01); B23K 103/02 (2006.01); B23K 103/04 (2006.01); B23K 103/10 (2006.01); B23K 103/12 (2006.01); B23K 103/08 (2006.01); B23K 26/384 (2014.01); B29C 65/20 (2006.01); B23K 26/382 (2014.01);
U.S. Cl.
CPC ...
B29C 37/0085 (2013.01); B23K 26/0006 (2013.01); B23K 26/352 (2015.10); B23K 26/355 (2018.08); B29C 45/14 (2013.01); B29C 45/14311 (2013.01); B29C 65/06 (2013.01); B29C 65/08 (2013.01); B29C 65/16 (2013.01); B29C 65/18 (2013.01); B29C 66/0246 (2013.01); B29C 66/7392 (2013.01); B29C 66/7394 (2013.01); B29C 66/742 (2013.01); B32B 3/30 (2013.01); B32B 7/04 (2013.01); B32B 15/08 (2013.01); B23K 26/384 (2015.10); B23K 26/389 (2015.10); B23K 2103/02 (2018.08); B23K 2103/05 (2018.08); B23K 2103/10 (2018.08); B23K 2103/12 (2018.08); B23K 2103/15 (2018.08); B29C 65/20 (2013.01); B29C 66/1122 (2013.01); B29C 66/30325 (2013.01); B29C 66/41 (2013.01); B29C 66/73921 (2013.01); B29C 66/73941 (2013.01); B29C 66/7422 (2013.01); B29C 66/74281 (2013.01); B29C 66/74283 (2013.01); B29C 2045/14327 (2013.01); B29C 2791/009 (2013.01);
Abstract

A bonded structure is made of a first member and a second member which are bonded to each other. At least one bore having an opening is formed in a surface of the first member, and the second member is filled in the bore of the first member. The bore is defined by a diameter-increasing portion whose opening size increases in a depth direction from a surface side toward a bottom of the first member, and a first diameter-decreasing portion whose opening size decreases in the depth direction from the surface side toward the bottom. The diameter-increasing portion is formed on the surface side, and the first diameter-decreasing portion is formed on a bottom side.

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