The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Oct. 27, 2017
Applicant:

Cree Fayetteville, Inc., Fayetteville, AR (US);

Inventors:

Zachary Cole, Summers, AR (US);

Brandon Passmore, Fayetteville, AR (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H05K 5/00 (2006.01); H01L 25/11 (2006.01); H01L 29/16 (2006.01); H01L 29/78 (2006.01); H05K 1/02 (2006.01); H01L 25/16 (2006.01); H01L 23/40 (2006.01); H02M 7/00 (2006.01); H02M 1/088 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0065 (2013.01); H01L 23/5382 (2013.01); H01L 25/115 (2013.01); H01L 25/162 (2013.01); H01L 29/1608 (2013.01); H01L 29/78 (2013.01); H05K 1/0298 (2013.01); H05K 5/0069 (2013.01); H01L 23/4093 (2013.01); H01L 25/072 (2013.01); H01L 2224/49111 (2013.01); H02M 1/088 (2013.01); H02M 7/003 (2013.01); H05K 2201/10166 (2013.01);
Abstract

A power module includes a number of sub-modules connected via removable jumpers. The removable jumpers allow the connections between one or more power semiconductor die in the sub-modules to be reconfigured, such that when the removable jumpers are provided, the power module has a first function, and when the removable jumpers are removed, the power module has a second function. The removable jumpers may also allow for independent testing of the sub-modules. The power module may also include a multi-layer printed circuit board (PCB), which is used to connect one or more contacts of the power semiconductor die. The multi-layer PCB reduces stray inductance between the contacts and therefore improves the performance of the power module.


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