The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Jan. 08, 2015
Applicant:

Ecole Polytechnique Federale DE Lausanne (Epfl), Lausanne, CH;

Inventors:

Ivan Rusev Minev, Lausanne, CH;

Stephanie P. Lacour, Daillens, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01); H05K 3/00 (2006.01); A61B 5/04 (2006.01); A61N 1/04 (2006.01); H05K 1/02 (2006.01); H01B 1/22 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); H05K 3/28 (2006.01); H05K 3/40 (2006.01); A61N 1/05 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H05K 3/007 (2013.01); A61B 5/04001 (2013.01); A61N 1/0476 (2013.01); H01B 1/22 (2013.01); H05K 1/0283 (2013.01); H05K 1/092 (2013.01); H05K 3/005 (2013.01); H05K 3/12 (2013.01); H05K 3/28 (2013.01); H05K 3/4038 (2013.01); A61B 2562/046 (2013.01); A61B 2562/125 (2013.01); A61N 1/0531 (2013.01); A61N 1/0551 (2013.01); H01L 23/4985 (2013.01); H01L 23/5387 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0272 (2013.01); H05K 3/284 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/0215 (2013.01); H05K 2201/0257 (2013.01); H05K 2201/0314 (2013.01); H05K 2201/0329 (2013.01); H05K 2203/1305 (2013.01); H05K 2203/166 (2013.01); Y10T 29/49165 (2015.01);
Abstract

A method produces a conductive paste comprising 15-20% by weight of PDMS and 80-85% by weight of metallic micro-nano particles, wherein the conductive paste is obtained by repeated addition of singular doses of PDMS to a heptane diluted PDMS low viscosity liquid containing the metallic micro-nano particles, wherein the heptane fraction is allowed to evaporate after addition of each of the singular doses of PDMS. A method forms a conductive path on a support layer, wherein the conductive path is encapsulated by an encapsulation layer comprising at least one via through which at least one portion of the conductive path is exposed, the method comprising filling the at least one via with the conductive paste.


Find Patent Forward Citations

Loading…