logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10448512 B1

PDFFull Text
Date of Patent:
Oct. 15, 2019

Filed:

Sep. 28, 2015

Printed circuit board

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Doo Hwan Lee, Suwon-si, KR;

Jong Rip Kim, Suwon-si, KR;

Ung Hui Shin, Suwon-si, KR;

Sung Hwan Cho, Suwon-si, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;

Attorney:

NSIP Law

Primary Examiner:

Tuan T Dinh

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H05K 1/0271 (2013.01); H01L 2224/04105 (2013.01); H01L 2924/3511 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/0187 (2013.01);
Abstract

There are provided a printed circuit board and a method to manufacture the same. The printed circuit board includes a core board including an insulating layer and a cavity, an electronic element in the cavity, and an insulating member disposed between inner surfaces of the cavity and the electronic element. A modulus of elasticity of the insulating member is lower than a modulus of elasticity of the insulating layer.

Find Patent Forward Citations

Lee, Doo. (2019). Printed circuit board (U.S. Patent No. 10448512). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10448512

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…