The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Jan. 29, 2018
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Isamu Morita, Nagaokakyo, JP;

Kuniaki Yosui, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 23/00 (2006.01); H01Q 1/38 (2006.01); H05K 1/11 (2006.01); H01R 24/50 (2011.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/02 (2006.01); H05K 3/46 (2006.01); H01Q 1/40 (2006.01); H01R 103/00 (2006.01); H05K 3/40 (2006.01); H05K 5/04 (2006.01); H01Q 9/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H01Q 1/38 (2013.01); H01Q 1/40 (2013.01); H01Q 23/00 (2013.01); H01R 24/50 (2013.01); H05K 1/0242 (2013.01); H05K 1/032 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 1/182 (2013.01); H05K 3/027 (2013.01); H05K 3/4697 (2013.01); H01Q 9/42 (2013.01); H01R 2103/00 (2013.01); H05K 1/188 (2013.01); H05K 3/4069 (2013.01); H05K 3/4617 (2013.01); H05K 3/4652 (2013.01); H05K 5/04 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10098 (2013.01);
Abstract

A multilayer substrate includes a base in which insulating base material layers including a thermoplastic resin are stacked, a conductor provided on at least one of the insulating base material layers, a ground electrode and a ground conductor, and a metal member connected to the conductor. The metal member is disposed inside the base and includes a portion extending in at least a stacking direction of the insulating base material layers and a portion extending in a planar direction parallel or substantially parallel to a principal surface of the insulating base material layers, and the metal member defines at least a portion of a circuit in contact with the base.


Find Patent Forward Citations

Loading…