The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
Jan. 13, 2017
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventor:
Ryo Fukuchi, Ibaraki, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); H05K 1/09 (2006.01); C22F 1/08 (2006.01); C25D 7/06 (2006.01); H05K 1/03 (2006.01); C25D 3/12 (2006.01); C25D 3/56 (2006.01); C25D 5/48 (2006.01); C25D 9/08 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); C22F 1/08 (2013.01); C25D 7/0614 (2013.01); C25D 3/12 (2013.01); C25D 3/38 (2013.01); C25D 3/562 (2013.01); C25D 5/48 (2013.01); C25D 9/08 (2013.01); H05K 1/0393 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0355 (2013.01);
Abstract
To provide a copper foil and a copper-clad laminate board that have a favorably suppressed transmission loss even in the use thereof in a high frequency circuit board that is folded in use or bent in use. A copper foil having a number of times of folding of 1 or more in a folding test under a prescribed condition for a copper-clad laminate board containing the copper foil having adhered thereto an insulating substrate.