The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Sep. 06, 2016
Applicants:

Autonetworks Technologies, Ltd., Yokkaichi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Inventors:

Takuya Ota, Mie, JP;

Shigeki Yamane, Mie, JP;

Hirotoshi Maeda, Mie, JP;

Toshiyuki Tsuchida, Mie, JP;

Yoshihiro Tozawa, Mie, JP;

Assignees:

AutoNetworks Technologies, Ltd., Yokkaichi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka-Shi, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 7/20 (2006.01); H05K 1/18 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H05K 1/0271 (2013.01); H05K 1/181 (2013.01); H05K 7/1427 (2013.01); H05K 7/209 (2013.01); H05K 2201/066 (2013.01); H05K 2201/068 (2013.01); H05K 2201/1009 (2013.01); H05K 2201/10113 (2013.01);
Abstract

A circuit assembly includes a circuit board on which a coil is mounted, a heat sink, and a heat spreading plate that is separate from this heat sink. A first insulating adhesive layer is interposed between the circuit board and the heat spreading plate, and the heat spreading plate and the heat sink are fixed by a first fixing hole for a heat sink and a bolt. Accordingly, warping of the circuit board is suppressed.


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