The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Dec. 21, 2017
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Yu-Chun Liu, Altamonte Springs, FL (US);

Arjun Ravindran, Orlando, FL (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/01 (2006.01); H01F 17/00 (2006.01); H05K 1/02 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01); H05K 1/11 (2006.01); H01F 41/04 (2006.01); H05K 1/16 (2006.01); H03H 1/00 (2006.01);
U.S. Cl.
CPC ...
H03H 7/0115 (2013.01); H01F 41/041 (2013.01); H01L 21/76832 (2013.01); H01L 21/76877 (2013.01); H01L 23/5227 (2013.01); H01L 28/10 (2013.01); H05K 1/0284 (2013.01); H05K 1/119 (2013.01); H05K 1/165 (2013.01); H01F 2017/002 (2013.01); H01F 2017/0026 (2013.01); H03H 2001/0085 (2013.01);
Abstract

Some aspects pertain to an apparatus that includes a plurality of stacked metal layers configured in a spiral shape. The plurality of stacked metal layers include a first metal layer including a first inductor, a second metal layer including a plurality of first pads and a plurality of second pads, a third metal layer including a plurality of third pads and a plurality of fourth pads, a fourth metal layer including a second inductor, a plurality of first vias configured to couple the first metal layer to the second metal layer, a plurality of second vias configured to couple the second metal layer to the third metal layer, a plurality of third vias configured to couple the third metal layer to the fourth metal layer; and a dielectric layer at least partially surrounding the apparatus.


Find Patent Forward Citations

Liu, Yu-Chun. (2019). Three dimensional inductor-capacitor apparatus and method of fabricating (U.S. Patent No. 10447226). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10447226

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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