The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
Oct. 21, 2016
Applicants:
Littelfuse Electronics (Shanghai) Co., Ltd., Shanghai, CN;
Littelfuse France Sas, Paris, FR;
Inventors:
Werner Johler, Shanghai, CN;
Philippe Di Fulvio, Paris, FR;
Assignees:
Littelfuse Electronics (Shanghai) Co., Ltd., Shanghai, CN;
Littelfuse France SAS, Paris, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 11/02 (2016.01); H02K 11/25 (2016.01); H02K 11/27 (2016.01); H02K 5/02 (2006.01); H02K 5/22 (2006.01); H02K 23/00 (2006.01); H01G 4/35 (2006.01); H01G 2/22 (2006.01); H03H 1/00 (2006.01); H01G 4/40 (2006.01); H02H 9/02 (2006.01); H02H 9/04 (2006.01);
U.S. Cl.
CPC ...
H02K 11/02 (2013.01); H01G 2/22 (2013.01); H01G 4/35 (2013.01); H02K 5/02 (2013.01); H02K 5/225 (2013.01); H02K 11/25 (2016.01); H02K 11/27 (2016.01); H02K 23/00 (2013.01); H03H 1/00 (2013.01); H01G 4/40 (2013.01); H02H 9/026 (2013.01); H02H 9/044 (2013.01); H02K 2213/03 (2013.01);
Abstract
An electromagnetic interference (EMI) circuit assembly includes a first, second, and third conductive layer. A protection component disposed between the first and second conductive layers. A dielectric layer is disposed between the second and the third conductive layers. The protection component is configured to protect a load from one or both of an overcurrent condition and an over temperature condition, and the third layer define a capacitor configured to suppress EMI signals.