The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Aug. 25, 2017
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Haitao Cheng, San Diego, CA (US);

Zhang Jin, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/00 (2006.01); H05K 1/02 (2006.01); H01P 1/30 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01P 3/003 (2013.01); H01P 1/30 (2013.01); H01P 11/001 (2013.01); H05K 1/0227 (2013.01); H05K 1/0245 (2013.01);
Abstract

A coplanar waveguide may include a first transmission line extending between a first ground plane and a second ground plane at a first interconnect level. The coplanar waveguide may further include a shielding layer at a second interconnect level. The shielding layer may include a first set of conductive fingers coupled to the first ground plane. The first set of conductive fingers may be interdigitated with a second set of conductive fingers that are coupled to the second ground plane. Only a dielectric layer may be between the first set of conductive interdigitated fingers and the second set of conductive interdigitated fingers. The first ground plane, the second ground plane, the dielectric layer, and the shielding layer may form a capacitor.


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