The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
Aug. 27, 2018
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Satoru Wakiyama, Kanagawa, JP;
Taizo Takachi, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 31/041 (2014.01); H01L 31/0216 (2014.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); H01L 27/14632 (2013.01); H01L 27/14685 (2013.01); H01L 31/02165 (2013.01); H01L 31/041 (2014.12); H01L 31/18 (2013.01); H01L 2224/13 (2013.01); H01L 2224/94 (2013.01); Y02E 10/50 (2013.01);
Abstract
A method of manufacturing a semiconductor device includes: forming, on a cover glass, a film having a predetermined specific gravity and configured to shield an alpha ray that arises from the cover glass; and bonding the cover glass on which the film is formed and an image pickup device, by filling a transparent resin between the cover glass and the image pickup device.