The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Dec. 28, 2017
Applicant:

SK Hynix Inc., Gyeonggi-do, KR;

Inventors:

Sung-Lae Oh, Chungcheongbuk-do, KR;

Dong-Hyuk Kim, Seoul, KR;

Soo-Nam Jung, Seoul, KR;

Assignee:

SK hynix Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11529 (2017.01); H01L 27/11519 (2017.01); H01L 27/11565 (2017.01); H01L 27/11524 (2017.01); H01L 27/11573 (2017.01); G11C 16/04 (2006.01); H01L 27/1157 (2017.01); H01L 27/11548 (2017.01); H01L 27/11575 (2017.01); G11C 16/08 (2006.01); H01L 27/11556 (2017.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11529 (2013.01); G11C 16/0483 (2013.01); H01L 27/1157 (2013.01); H01L 27/11519 (2013.01); H01L 27/11524 (2013.01); H01L 27/11548 (2013.01); H01L 27/11565 (2013.01); H01L 27/11573 (2013.01); H01L 27/11575 (2013.01); G11C 16/08 (2013.01); H01L 27/11556 (2013.01); H01L 27/11582 (2013.01);
Abstract

A semiconductor memory device includes first and second memory blocks each including conductive and dielectric layers alternately stacked over a semiconductor layer disposed over a substrate, and disposed adjacent to each other in a first direction; a dummy block disposed over the semiconductor layer, and provided between the first and second memory blocks; first pass transistors formed over the substrate below the first memory block, and coupled to conductive layers, respectively, of the first memory block; second pass transistors formed over the substrate below the second memory block, and coupled to conductive layers, respectively, of the second memory block; bottom global row lines between the first and second pass transistors and the semiconductor layer, and each coupled to one of the first pass transistors and one of the second pass transistors; and top global row lines formed over the dummy block, and coupled to the bottom global row lines.


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