The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
Jan. 23, 2018
Applicant:
Realtek Semiconductor Corporation, Hsinchu, TW;
Inventors:
Hsiao-Tsung Yen, Hsinchu, TW;
Ping-Yuan Deng, Taoyuan, TW;
Yuh-Sheng Jean, Hsinchu County, TW;
Ta-Hsun Yeh, Hsinchu, TW;
Assignee:
REALTEK SEMICONDUCTOR CORPORATION, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); H01L 23/66 (2013.01); H01L 24/43 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/494 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49431 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/381 (2013.01);
Abstract
A semiconductor package structure is disclosed. The semiconductor package structure comprises a plurality of layered structures, a plurality of wires, and a first ring structure. The wires are connected to each of the layered structures. The first ring structure is coupled to at least one of the layered structures and positioned between the wires.