The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Sep. 12, 2017
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Howard E. Chen, Anaheim, CA (US);

Matthew Sean Read, Foothill Ranch, CA (US);

Assignee:

Skyworks Solutions, Inc., Woburn, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/45 (2013.01); H01L 24/85 (2013.01); H01L 24/48 (2013.01); H01L 2223/6655 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05013 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/45016 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3025 (2013.01);
Abstract

Shielded radio-frequency (RF) module having reduced area. In some embodiments, a method for fabricating a radio-frequency module includes forming or providing a packaging substrate configured to receive a plurality of components. The method may include mounting one or more devices on the packaging substrate such that the packaging substrate includes a first area associated with mounting of each of the one or more devices. In some embodiments, the method further includes forming a plurality of shielding wirebonds on the packaging substrate to provide RF shielding functionality for one or more regions on the packaging substrate, such that the packaging substrate includes a second area associated with formation of each shielding wirebond, the mounting of each device implemented with respect to a corresponding shielding wirebond such that a portion of the first area associated with the device overlaps at least partially with a portion of the second area associated with the corresponding shielding wirebond.


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