The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10446465 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 15, 2019

Filed:

Nov. 06, 2017
Applicant:

Samsung Display Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Eun Suk Kim, Yongin-si, KR;

Moon Ju Kim, Asan-si, KR;

Jin Woo Park, Asan-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); G09G 3/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/36 (2013.01); H01L 23/4985 (2013.01); H01L 24/32 (2013.01); G09G 3/2092 (2013.01); G09G 2320/041 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/1426 (2013.01);
Abstract

Provided are chip-on-film package and display device including the same. The chip-on-film package comprises: a base film; a driving chip which is disposed on a surface of the base film; and a heat radiating member which is disposed on the driving chip and comprises a first heat radiating pad portion, a second heat radiating pad portion separated from the first heat radiating pad portion in a first direction, a connecting portion disposed between the first heat radiating pad portion and the second heat radiating pad portion, and one or more protrusions extending from the first heat radiating pad portion or the second heat radiating pad portion along an oblique direction in the first direction, wherein the connecting portion at least partially overlaps the driving chip.


Find Patent Forward Citations

Kim, Eun. (2019). Chip-on-film package and display device including the same (U.S. Patent No. 10446465). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10446465

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