The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
May. 02, 2016
Sony Corporation, Tokyo, JP;
Toshiyuki Iijima, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
To cooled down a circuit to an appropriate temperature. An electronic device is provided with a low-temperature-side deformation member, and a high-temperature-side deformation member. In this electronic device, when a temperature of a circuit to be cooled becomes higher than a set temperature that is lower between two different set temperatures, the low-temperature-side deformation member deforms, and comes in contact with a heat dissipation member having a smaller heat capacity between two heat dissipation members having different heat capacities. In addition, when the temperature of the circuit becomes higher than a set temperature that is higher between the two different set temperatures, the high-temperature-side deformation member deforms, and comes in contact with a heat dissipation member having a larger heat capacity between the two heat dissipation members.