The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Oct. 19, 2016
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Takayuki Aoyama, Kyoto, JP;

Hikaru Kawarazaki, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/225 (2006.01); H01L 21/324 (2006.01); H01L 21/67 (2006.01); H01L 21/268 (2006.01); H01L 29/16 (2006.01); H01J 61/54 (2006.01); H05B 41/34 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/2251 (2013.01); H01L 21/2253 (2013.01); H01L 21/2686 (2013.01); H01L 21/324 (2013.01); H01L 21/67115 (2013.01); H01L 29/16 (2013.01); H01J 61/547 (2013.01); H01L 29/7836 (2013.01); H05B 41/34 (2013.01);
Abstract

When an insulated gate bipolar transistor is incorporated in a drive circuit of a flash lamp, so that a light emission pattern of the flash lamp is freely defined, a temperature change pattern of a surface of a semiconductor wafer that receives the emission of flash light can be adjusted. The length of diffusion of impurities can be controlled by rising a surface temperature of the semiconductor wafer from a preheating temperature to a diffusion temperature through emission of flash light and maintaining the surface temperature at the diffusion temperature for a time period not shorter than 1 millisecond and not longer than 10 milliseconds. Subsequently, the impurities can be activated by rising the surface temperature of the semiconductor wafer from the diffusion temperature to an activation temperature.


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