The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
Dec. 13, 2017
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Yohei Noda, Tokyo, JP;
Hirobumi Tanaka, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/12 (2006.01); C03C 10/00 (2006.01); C04B 35/468 (2006.01); H01G 4/224 (2006.01); C03C 3/085 (2006.01); C03C 3/087 (2006.01); C03C 3/089 (2006.01); C03C 3/091 (2006.01); C03C 8/24 (2006.01); C03C 14/00 (2006.01); H01C 7/18 (2006.01); H01G 4/232 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); C03C 3/085 (2013.01); C03C 3/087 (2013.01); C03C 3/089 (2013.01); C03C 3/091 (2013.01); C03C 8/24 (2013.01); C03C 10/00 (2013.01); C03C 10/0009 (2013.01); C03C 10/0036 (2013.01); C03C 14/006 (2013.01); C04B 35/468 (2013.01); C04B 35/4682 (2013.01); H01C 7/18 (2013.01); H01G 4/129 (2013.01); H01G 4/224 (2013.01); C03C 2214/20 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3262 (2013.01); C04B 2235/36 (2013.01); C04B 2235/6562 (2013.01); C04B 2235/6565 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/6582 (2013.01); H01G 4/12 (2013.01); H01G 4/1227 (2013.01); H01G 4/232 (2013.01);
Abstract
The present invention relates to a multilayer electronic component which includes an element body where a plurality of internal electrode layers and dielectric layers are alternately laminated. Insulating layers are disposed on a pair of side surfaces of the element body, facing each other. The insulating layers contain a glass composition and a ceramic composition.