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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10446302 B1

PDFFull Text
Date of Patent:
Oct. 15, 2019

Filed:

Nov. 15, 2016

Chip resistor and methods of producing the same

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Eiji Nukaga, Kyoto, JP;

Hiroshi Tamagawa, Kyoto, JP;

Yasuhiro Kondo, Kyoto, JP;

Katsuya Matsuura, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Kyung S Lee

Int. Cl.
CPC ...
H01C 17/00 (2006.01); H01C 17/242 (2006.01); H01C 7/00 (2006.01); H01C 13/02 (2006.01); H01C 17/06 (2006.01); H01G 2/06 (2006.01); H01C 17/08 (2006.01); H01F 27/40 (2006.01); H01G 4/38 (2006.01); H01G 4/40 (2006.01); H01L 21/3065 (2006.01); H01L 21/78 (2006.01); H01L 23/525 (2006.01); H01L 23/528 (2006.01); H01L 29/66 (2006.01); H01L 29/861 (2006.01);
U.S. Cl.
CPC ...
H01C 17/006 (2013.01); H01C 7/00 (2013.01); H01C 7/006 (2013.01); H01C 13/02 (2013.01); H01C 17/06 (2013.01); H01C 17/08 (2013.01); H01C 17/242 (2013.01); H01F 27/402 (2013.01); H01G 2/065 (2013.01); H01G 4/38 (2013.01); H01G 4/40 (2013.01); H01L 21/3065 (2013.01); H01L 21/78 (2013.01); H01L 23/528 (2013.01); H01L 23/5256 (2013.01); H01L 29/6609 (2013.01); H01L 29/861 (2013.01); Y10T 29/49082 (2015.01);
Abstract

A chip resistor includes: a board having a device formation surface, a back surface opposite from the device formation surface and side surfaces connecting the device formation surface to the back surface, a resistor portion provided on the device formation surface, a first connection electrode and a second connection electrode provided on the device formation surface and electrically connected to the resistor portion, and a resin film covering the device formation surface with the first connection electrode and the second connection electrode being exposed therefrom. Intersection portions of the board along which the back surface intersects the side surfaces each have a rounded shape.

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