The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
Jun. 28, 2016
Applicant:
Epcos Ag, München, DE;
Inventors:
Josef Mörth, St. Martin I.S., AT;
Gilbert Landfahrer, Deutschlandsberg, AT;
Gerald Kloiber, Feldkirchen, AT;
Anna Moshammer, Graz, AT;
Assignee:
EPCOS AG, München, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 1/144 (2006.01); H01C 17/065 (2006.01); H01C 1/142 (2006.01); H01C 17/28 (2006.01); H01C 7/04 (2006.01); H01C 1/01 (2006.01); H01C 1/14 (2006.01); H01C 7/00 (2006.01);
U.S. Cl.
CPC ...
H01C 7/043 (2013.01); H01C 1/01 (2013.01); H01C 1/142 (2013.01); H01C 1/144 (2013.01); H01C 1/1413 (2013.01); H01C 7/003 (2013.01); H01C 7/044 (2013.01); H01C 17/065 (2013.01); H01C 17/06533 (2013.01); H01C 17/28 (2013.01); H01C 17/06546 (2013.01);
Abstract
A method for producing an electrical component is disclosed. In an embodiment the method includes providing a carrier element providing a material having a temperature-dependent resistance, applying the material on a surface of the carrier element for producing a resistance layer on the carrier element and subsequently sintering the resistance layer for linking the resistance layer to the carrier element.