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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10446295 B1

PDFFull Text
Date of Patent:
Oct. 15, 2019

Filed:

Jan. 23, 2017

Chip resistor and method for producing the same

Applicant:

Koa Corporation, Ina-shi, Nagano, JP;

Inventor:

Yasushi Hiroshima, Nagano, JP;

Assignee:

KOA CORPORATION, Nagano, JP;

Attorney:

Brinks Gilson & Lione

Primary Examiner:

William Coleman

Int. Cl.
CPC ...
H01C 1/028 (2006.01); H01C 1/032 (2006.01); C23C 14/06 (2006.01); C23C 16/40 (2006.01); H01C 7/00 (2006.01); H01C 17/12 (2006.01); H01C 17/16 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01); H01C 1/14 (2006.01); H01C 17/02 (2006.01); B23K 26/382 (2014.01); H01C 7/02 (2006.01);
U.S. Cl.
CPC ...
H01C 1/028 (2013.01); C23C 14/0652 (2013.01); C23C 16/402 (2013.01); H01C 1/032 (2013.01); H01C 1/14 (2013.01); H01C 7/006 (2013.01); H01C 17/02 (2013.01); H01C 17/12 (2013.01); H01C 17/16 (2013.01); H01L 23/5228 (2013.01); H01L 28/24 (2013.01); B23K 26/382 (2015.10); H01C 7/023 (2013.01);
Abstract

Provided is a thin-film chip resistor including an insulating substrate; a thin-film resistive element formed on the substrate; a pair of electrodes connected to the thin-film resistive element; and a protective film covering at least the thin-film resistive element between the pair of electrodes, in which the protective film includes a first protective film and a second protective film, the first protective film containing silicon nitride in contact with the thin-film resistive element, and the second protective film containing silicon oxide in contact with the first protective film.

Find Patent Forward Citations

Hiroshima, Yasushi. (2019). Chip resistor and method for producing the same (U.S. Patent No. 10446295). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10446295

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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