The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Dec. 26, 2017
Applicant:

Eosmem Corporation, Zhubei, TW;

Inventors:

Chern-Lin Chen, Zhubei, TW;

Shuang-Chin Wu, Zhubei, TW;

Ying-Yi Wu, Zhubei, TW;

Assignee:

EOSMEM CORPORATION, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06F 1/16 (2006.01); H01L 27/146 (2006.01); H04M 1/02 (2006.01);
U.S. Cl.
CPC ...
G06K 9/00053 (2013.01); G06F 1/1626 (2013.01); G06K 9/0004 (2013.01); H01L 27/14623 (2013.01); H01L 27/14698 (2013.01); H04M 1/026 (2013.01);
Abstract

A fingerprint identification device and a method for manufacturing the fingerprint identification device are provided. The fingerprint identification device includes a solder ball array, a re-distribution layer, an image sensing integrated circuit (IC), a light emitting circuit, a photic layer and a molding material. The re-distribution layer disposed on the solder ball array is electrically connected to a plurality of solder balls. The image sensing IC includes a plurality of through silicon vias (TSVs), and the TSVs are correspondingly electrically connected to the solder balls, respectively, through the re-distribution layer. The light emitting circuit is disposed on one side of the image sensing IC, and electrically connected to the image sensing IC through the re-distribution layer. The image sensing IC controls the light emitting circuit. The photic layer is disposed on the image sensing IC. The molding material encloses the image sensing IC.


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