The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
Jan. 25, 2017
Applicant:
Invensense, Inc., San Jose, CA (US);
Inventor:
Julius Ming-Lin Tsai, San Jose, CA (US);
Assignee:
InvenSense, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); B06B 1/06 (2006.01); B06B 1/02 (2006.01); G10K 9/00 (2006.01); G10K 11/30 (2006.01);
U.S. Cl.
CPC ...
G06K 9/0002 (2013.01); B06B 1/0292 (2013.01); B06B 1/06 (2013.01); B06B 1/0622 (2013.01); G10K 11/30 (2013.01); G06K 9/0008 (2013.01);
Abstract
An electronic device including an array of ultrasonic transducers for generating and receiving ultrasonic signals, and an acoustic coupling layer overlying the array of ultrasonic transducers, where the ultrasonic signals are propagated through the acoustic coupling layer.
Tsai, Julius Ming-Lin. (2019). Device mountable packaging of ultrasonic transducers (U.S. Patent No. 10445547). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10445547
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile