The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Sep. 08, 2016
Applicant:

Cloud Network Technology Singapore Pte., Ltd., Singapore, SG;

Inventors:

Wen-Chen Wang, New Taipei, TW;

Huang-Jyun Lu, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03G 15/00 (2006.01);
U.S. Cl.
CPC ...
G03G 15/6502 (2013.01);
Abstract

The disclosure discloses an apparatus for assembling a multi-component structure. The apparatus for assembling includes a pushing member fixed to a first component, a latch unit corresponding to the pushing member, the latch unit fixed to a second component. when the first component is not installed to a predetermined position of the second component, the latch unit stays in a locking position to prevent the second component from being installed to a third component; when the first component is installed to the predetermined position of the second component, the latch unit stays in an unlocking position and the second component is released to be installed to the third component. A multi-component structure is further disclosed.


Find Patent Forward Citations

Wang, Wen-Chen. (2019). Assembling apparatus and multicomponent structure using the same (U.S. Patent No. 10444692). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10444692

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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