The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Jan. 25, 2019
Applicant:

Shaanxi Normal University, Xi'an, CN;

Inventors:

Zhihui Jia, Xi'an, CN;

Yuhu Li, Xi'an, CN;

Xiaolian Chao, Xi'an, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 43/00 (2006.01); F17C 7/04 (2006.01); G03F 7/26 (2006.01); G03F 7/34 (2006.01);
U.S. Cl.
CPC ...
G03F 7/343 (2013.01); B32B 43/006 (2013.01); F17C 7/04 (2013.01); B32B 2310/0427 (2013.01); Y10T 156/1111 (2015.01); Y10T 156/1126 (2015.01); Y10T 156/1153 (2015.01); Y10T 156/1911 (2015.01); Y10T 156/1928 (2015.01);
Abstract

A separating device and method for a bonded cine film, belonging to the field of image file protection and repair technologies. The separating device comprises a pressurizing device, a separating device and a liquid nitrogen storage device. The pressurizing device is connected to the liquid nitrogen storage device; the liquid nitrogen storage device is connected to the separating device for providing liquid nitrogen thereto; the separating device comprises a film receiving chamber for accommodating a film to be separated; the pressurizing device pressurizes the liquid nitrogen storage device allowing liquid nitrogen to enter the film receiving chamber. Due to a difference between expansion coefficients of a base layer and emulsion layer of the film under low temperature, micro-pores and gaps may be generated in the base layer and the emulsion layer of a bonded film roll; the liquid nitrogen penetrates into the micro-pores and gaps of the bonded film.


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