The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Aug. 30, 2017
Applicant:

Honeywell International Inc., Morris Plains, NJ (US);

Inventors:

Deepak Kumar, Uttarakhand, IN;

Surya Raichor, Telangana, IN;

Anubhab Patra, Telangana, IN;

Prakash Bist, Andra Pardesh, IN;

Shiv Rai, Delhi, IN;

Assignee:

Honeywell International Inc., Morris Plains, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01K 7/00 (2006.01); G01K 1/00 (2006.01); G01K 3/06 (2006.01); G01K 7/22 (2006.01); G01K 7/02 (2006.01); G01K 15/00 (2006.01); G01K 1/02 (2006.01);
U.S. Cl.
CPC ...
G01K 3/06 (2013.01); G01K 1/026 (2013.01); G01K 7/02 (2013.01); G01K 7/22 (2013.01); G01K 15/005 (2013.01); G01K 15/007 (2013.01);
Abstract

Systems and methods for temperature measurement. In an example embodiment, two or more arrays of multi-spot temperature elements can be implemented, wherein at least one array among the two or more arrays constitutes a primary temperature measurement array and at least one other array among the two or more arrays constitutes a redundant temperature measurement array. The redundant temperature measurement array includes redundant spot temperature elements equivalent to spot temperature elements associated with the primary temperature measurement array. A transmitter assembly can also be provided, which communicates electronically with the aforementioned two or more arrays, and which processes and controls such arrays of the multi-spot temperature elements. The secondary (redundant) elements can be configured from the same material as that of the primary spot element(s) or can be composed of a different material depending on the sensor type (e.g., thermcouple, thermistor, etc.).


Find Patent Forward Citations

Loading…