The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Apr. 25, 2016
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Michael L. Andersen, Denver, CO (US);

Travis L. Mayberry, Dallas, TX (US);

Gregory P. Schaefer, McKinney, TX (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/06 (2006.01); F28F 9/02 (2006.01); B23K 20/10 (2006.01); B23K 20/22 (2006.01); B23K 20/233 (2006.01); F28F 7/02 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B23K 101/14 (2006.01); B23K 103/10 (2006.01); B23K 103/08 (2006.01);
U.S. Cl.
CPC ...
F28F 9/02 (2013.01); B23K 20/10 (2013.01); B23K 20/103 (2013.01); B23K 20/22 (2013.01); B23K 20/2336 (2013.01); F28F 7/02 (2013.01); B23K 2101/14 (2018.08); B23K 2103/08 (2018.08); B23K 2103/10 (2018.08); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); F28F 2250/106 (2013.01);
Abstract

A manifold structure and method of forming a structure having at least one enclosed cavity includes using an ultrasonic additive manufacturing (UAM) process to build up a solid component, forming a cavity in the solid component, filling the cavity with a sacrificial material, using a UAM process to build up a finstock layer over the cavity filled with the powder material to enclose the cavity and form the enclosed cavity, and removing the sacrificial material from the enclosed cavity after the finstock layer is ultrasonically welded to the solid component. The sacrificial material has an adequate density to support the UAM process of forming the finstock layer over the cavity and the material may be removed from the enclosed cavity, resulting in an enclosed cavity having smooth surfaces with an optimal fluid flow area therethrough.


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