The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Oct. 23, 2014
Applicants:

Mitsubishi Heavy Industries Thermal Systems, Ltd., Tokyo, JP;

Central Glass Co., Ltd., Ube-shi, Yamaguchi, JP;

Inventors:

Kenji Ueda, Tokyo, JP;

Naoki Kobayashi, Tokyo, JP;

Yoshinori Akamatsu, Tokyo, JP;

Fuyuhiko Sakyu, Tokyo, JP;

Yoshio Nishiguchi, Saitama, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F25B 43/00 (2006.01); C09K 5/04 (2006.01); F25B 30/02 (2006.01); F25B 49/00 (2006.01);
U.S. Cl.
CPC ...
F25B 43/003 (2013.01); C09K 5/044 (2013.01); C09K 5/045 (2013.01); F25B 30/02 (2013.01); F25B 49/005 (2013.01); C09K 2205/126 (2013.01);
Abstract

The present invention provides a heat pump device and an organic Rankine cycle device that are capable of maintaining a stable thermal cycle even when an HFO is used as the refrigerant in an environment in which the operating temperature reaches a high temperature. The refrigerant circulation device is filled with a refrigerant comprising a hydrofluoroolefin or hydrochlorofluoroolefin having a carbon-carbon double bond within the molecular structure, and has a region in the refrigerant circulation circuit where the operating temperature of the refrigerant reaches 175° C. or higher, wherein an acid suppression unit which suppresses any increase in the acid concentration in the refrigerant is provided in the region where the operating temperature of the refrigerant can reach 175° C. or higher, and the acid suppression unit contains an acid suppression material comprising at least two materials selected from the group consisting of copper, iron, aluminum, SUS, nickel, titanium, metallic silicon, silicon steel, tin, magnesium and zinc as the main components.


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