The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Feb. 11, 2015
Applicant:

Nec Europe Ltd., Heidelberg, DE;

Inventors:

Anett Schuelke, Gaiberg, DE;

Mischa Schmidt, Heidelberg, DE;

Assignee:

NEC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F24F 11/30 (2018.01); G05B 15/02 (2006.01); F24F 11/62 (2018.01); G05B 13/02 (2006.01); F24F 140/60 (2018.01); F24F 120/20 (2018.01); F24F 130/20 (2018.01); F24F 11/64 (2018.01); F24F 130/00 (2018.01); F24F 130/10 (2018.01); F24F 11/46 (2018.01); F24F 11/65 (2018.01); F24F 11/56 (2018.01); F24F 110/10 (2018.01); F24F 110/12 (2018.01);
U.S. Cl.
CPC ...
F24F 11/30 (2018.01); F24F 11/62 (2018.01); G05B 13/0265 (2013.01); G05B 15/02 (2013.01); F24F 11/46 (2018.01); F24F 11/56 (2018.01); F24F 11/64 (2018.01); F24F 11/65 (2018.01); F24F 2110/10 (2018.01); F24F 2110/12 (2018.01); F24F 2120/20 (2018.01); F24F 2130/00 (2018.01); F24F 2130/10 (2018.01); F24F 2130/20 (2018.01); F24F 2140/60 (2018.01); G05B 2219/2614 (2013.01);
Abstract

A method for operating a thermal system, wherein a component of a facility or building has to be heated and/or cooled by the thermal system, includes selecting a control mode of the thermal system for bringing and/or maintaining the component to or at a definable temperature value or to or within a definable temperature value range. The control mode is dynamically selected from multiple different control modes under consideration of at least one boundary condition of the component and/or at least one environmental context parameter and under consideration of data regarding learnt/adapted thermal behavior of the component.


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